Silica yellow skin cleaning machine

1. In 2010, some procts such as diffusion furnace and plasma etcher began to be exported in a small amount, providing 8 kinds of 10 kinds of large-scale solar cell proction line equipment, including 6 kinds (diffusion furnace, plasma etcher, cleaning / Velvet machine, quartz tube cleaning machine, etc.) Low temperature drying furnace (LTF) has occupied a dominant position in the domestic proction line. Two kinds of equipment (tubular PECVD, fast sintering furnace) coexist with imported equipment, but the share is graally increasing. Three kinds of equipment (automatic screen printing machine, automatic sorting machine, flat PECVD) are completely dependent on imports; In China, only Shanghai Jintai environmental protection Co., Ltd. has mastered the cleaning and velvet cleaning technology after slicing silicon wafer

International Business: smart, SEMATECH, ACM

2. After the machine stops, take out all the baskets, and then soak the silicon wafers in clean water. If the machine presses the baskets, it will be repaired. The gantry hanger type equipment is especially easy to press the baskets, but the efficiency is high. I still think the mechanical arm type is stable

3. The yellow skin on the surface of silica is a thin film of iron oxide, which is a common phenomenon in the development of silica resources. The treatment method depends on the degree of rust, and generally uses scrubbing (neutral scrubbing and weak acid scrubbing). If the rust is serious and the quality of silica procts is required to be high, the yellow skin on the surface of silica is a kind of iron oxide film, This kind of silica can not be used.
under the action of mechanical stirring, the particles rub against each other to remove rust and clean the surface.
acid pickling is also a method for removing impurities in silica. Sulfuric acid, hydrochloric acid or aqua regia can be used, but it is better to wet silica first, and a little hydrofluoric acid is better

4. 1、 Brief introction of monocrystalline silicon ultrasonic cleaning machine:
with the development of semiconctor material technology, higher requirements are put forward for the specification and quality of silicon wafers, and the market demand proportion of large diameter silicon wafers suitable for micro machining will increase day by day. Semiconctor, chip, integrated circuit, design, layout, chip, manufacturing, process. At present, the world generally adopts advanced cutting, grinding, polishing and clean packaging process, which has made significant progress in film making technology. With the introction of the latest cutting-edge technology, the trial proction and development of SOI and other high-function chips have entered the stage of mass proction. In this regard, silicon wafer manufacturers have also increased the equipment investment for 300 mm silicon wafer, and further refined the design rules. Using ultrasonic cleaning technology, in the cleaning process, the ultrasonic frequency in a reasonable range of reciprocating sweep, driving the cleaning solution to form a fine reflux, so that the workpiece dirt is quickly removed from the surface of the workpiece while being stripped by ultrasonic, improving the cleaning efficiency< Working principle of ultrasonic cleaning machine for monocrystalline silicon:
1. Vacuum degassing: effectively remove the gas in the liquid, and use the throwing function to enhance the cleaning ability of ultrasonic for oil and dirt on the surface of the workpiece and shorten the cleaning time
2. Rotating mechanism of washing basket: overlapped and inseparable parts or parts with complex shape can be cleaned evenly and completely
3. Decompression vacuum system: it can suck out the air between blind holes, gaps and superimposed parts, so that the ultrasonic wave can proce amazing cleaning effect under the condition of decompression
4. Vacuum steam cleaning + vacuum drying system: steam cleaning is used for maintenance to achieve perfect cleaning effect
5. The whole process of steam cleaning, drying and cleaning solution heating is carried out in vacuum, which ensures the safety more effectively
6. Explosion proof accessories and simple heating system further improve the safety.

5. The structural features of polysilicon ultrasonic cleaning are as follows:
1. Three sets of independent computer-controlled mechanical arms are used for automatic operation
2. The third generation of the latest technology and comprehensive anti acid and anti-corrosion measures are adopted to protect every corner of the machine
3. The latest automatic liquid replenishment technology
4. The unique pre-treatment technology of silicon wafer drying ensures that the silicon wafer drying does not leave any water marks
5 Mature silicon wafer drying process, a variety of advanced technology in one
6. Color large screen man-machine interface operation, convenient parameter setting, multi process mode conversion

6. Now many laboratories use ultrasonic cleaning machine to clean laboratory glassware, instruments, etc. ultrasonic has good cleaning effect on slit, deep hole, blind hole, dead angle, etc., which is incomparable and alternative to other cleaning methods. At present, ultrasonic cleaning machine has been widely used in chemical, pharmaceutical, food, biological and medical fields.

7. Most of them can be washed, but the cotton procts don't need to be washed by ultrasonic machine