OSP mining machine

1.

OSP is the abbreviation of organic solderability preserves, which is translated as organic solder mask in Chinese. It is a process of copper foil surface treatment of printed circuit board, which meets the requirements of RoHS directive

OSP is to grow a layer of organic film on the clean bare copper surface by chemical method. The film has the properties of anti-oxidation, heat shock resistance and moisture resistance, so as to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in normal environment

extended data:

1. OSP Application guide

solder paste printing process should be mastered well, because the poorly printed board cannot be cleaned with IPA, which will damage the OSP layer. The thickness of transparent and non-metallic OSP layer is not easy to measure, and the degree of transparency to coating coverage is not easy to see, so it is difficult to evaluate the quality stability of suppliers in these aspects

There is no IMC isolation between Cu in pad and Sn in solder in OSP technology. In lead-free technology, SnCu in solder joints with high Sn content increases rapidly, which affects the reliability of solder joints

The disadvantages of OSP are as follows: there are many kinds of formulas and different performances. In other words, the certification and selection of suppliers should be done well. The disadvantage of OSP process is that the protective film is very thin and easy to scratch (or scratch)

must be operated and amplified carefully. At the same time, the OSP film (that is, the OSP film on the unwelded connection plate) after several high temperature welding processes will change color or crack, which will affect the solderability and reliability

2. OSP is a process of copper foil surface treatment for printed circuit board (PCB) in accordance with ROHS directive. OSP is the abbreviation of organic solderability preserves, which is translated into Chinese as organic solder mask, also known as copper protecting agent, also known as preflux in English. In short, OSP is to grow a layer of organic film on the clean bare copper surface by chemical method. The film has the properties of anti-oxidation, heat shock resistance and moisture resistance, so as to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in normal environment; However, in the subsequent welding high temperature, the protective film must be easily removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder in a very short time to form a solid solder joint
OSP process
oil removal --- & gt; Secondary water wash; Micro etching -- & gt; Secondary water wash; Pickling -- & gt; DI water wash -- & gt; Film forming and air drying; DI water wash -- & gt; Drying 1. Degreasing effect directly affects the film quality. If the oil removal is not good, the film thickness is not uniform. On the one hand, the concentration can be controlled within the process range by analyzing the solution. On the other hand, it is necessary to check whether the oil removal effect is good. If the oil removal effect is not good, the oil removal fluid should be replaced in time. 2. The purpose of micro etching is to form a rough copper surface for film formation. The thickness of micro etching directly affects the film forming rate. Therefore, it is very important to maintain the stability of micro etching thickness in order to form a stable film thickness. Generally, it is appropriate to control the micro etching thickness at 1.0-1.5um. Before the proction of each shift, the micro etching rate can be measured, and the micro etching time can be determined according to the micro etching rate. 3. It is better to use DI water for washing before film-forming to prevent the film-forming liquid from being polluted. It is better to use DI water for washing after film forming, and the pH value should be controlled between 4.0 and 7.0 to prevent the film from being polluted and damaged. The key of OSP process is to control the thickness of anti-oxidation film. The film is too thin and has poor thermal shock resistance. In over reflow soldering, the film can not withstand high temperature (190-200 ℃) ° C) In the electronic assembly line, the film can not be well dissolved by the flux, which affects the welding performance. Generally, it is appropriate to control the film thickness between 0.2-0.5um
edit the shortcomings of this section of OSP process
of course, OSP also has its shortcomings, such as many kinds of actual formula and different performance. In other words, the certification and selection of suppliers should be done well. The disadvantage of OSP process is that the protective film is very thin and easy to scratch (or scratch), so it must be operated carefully. At the same time, the OSP film (that is, the OSP film on the unwelded connection plate) after several high temperature welding processes will change color or crack, which will affect the solderability and reliability. Figure 1 acceptable standard and physical picture of OSP oxidation discoloration

3. Okuma is a world-famous machine tool manufacturer with a long history. OSP numerical control system is a control system designed and manufactured by the company, which is specially for the machine tools of the company. Since 1990s, OSP numerical control system has been widely used by many famous machine tool factories in China. With the increasing number of imported and domestic OSP CNC machine tools, the popularization of their maintenance knowledge has become a problem of great concern to machine tool manufacturers and end users.

4. It depends on the proct samples for details

5. This technology is a new foundation, and its skills are very high, and many people are using it.

6.

1、 Refers to different

1, OSP board: printed circuit board (PCB) copper foil surface treatment in line with the RoHS directive requirements of a process

PCB: Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, is the support of electronic components, is the carrier of electrical connection of electronic components

OSP board: a layer of organic film is chemically grown on the clean bare copper surface. The film has the properties of anti-oxidation, heat shock resistance and moisture resistance, so as to protect the copper surface from further rusting in normal environment

2. PCB: it is made by electronic printing

OSP board: in high welding temperature, this kind of protective film must be easily removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder in a very short time to form a solid solder joint

2. PCB board: after using PCB for electronic equipment, e to the consistency of the same kind of PCB, the manual wiring error can be avoided, and the electronic components can be automatically inserted or pasted, soldered and detected, so as to ensure the quality of electronic equipment, improve labor proctivity, rece cost and facilitate maintenance

7. What does this mean? Is it like medicine; There are five pills in the bag

8. OSP is a kind of surface treatment of plating chemical film on the plate surface. Compared with other surface treatment of covering tin and gold, the cost of this process is low. However, e to excessive acid in proction, it has great damage to the copper surface and hole copper. Generally, it can only be reworked once. If it is reworked again, the hole copper will not be thick enough or broken, so there is a saying that the reworkability is poor.

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